DETAILED CASE AND MODULE DESCRIPTION
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8-1
SIG-00-22-02 JUNE 2022 (Revised September 2022)
Version: B.1
SECTION 8
DETAILED CASE AND MODULE DESCRIPTION
8
DETAILED CASE AND MODULE DESCRIPTION
The GCP5000 (GCE) consists of:
•
a case assembly
•
a motherboard
•
plug-in circuit modules
•
plug-in external wiring connectors
8.1.1 Case Assemblies
Each GCP5000 (GCE) case assembly consists of a powder-coated steel case with a backplane-
mounted motherboard.
The A80905 contains:
•
A80903-2021 CPU III
•
Up to five A80428 PSO modules
•
Up to two A80405 SSCC IIIi internal crossing controller modules
•
Up to three, A80413 RIO Modules. These can be used in place of the PSO modules in
Slots 2,4, and 5 (named as M3, M5, and M6 in Figure 8-3)
•
A80410 SEAR IIi module
•
A80485 Display Module
8.1.2 Motherboard
The Motherboard for each assembly provides:
•
GCE unit wiring
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Circuit module connectors
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External Configuration Device Connector(s)
•
Chassis Identification Chip socket(s)
•
Interface connectors for external wiring connectors
•
Echelon LONTALK
®
PROTOCOL LAN connector (See Siemens Echelon
Configuration Handbook, COM-00-07-09).
•
The RJ-45 Ethernet connectors