IMR01Y09-E3
i-3
CONTENTS
Page
1. OUTLINE............................................................................... 1
1.1 Checking the Product ......................................................................................2
1.2 Model Code .....................................................................................................2
1.3 Parts Description .............................................................................................3
2. HANDLING PROCEDURES ................................................. 5
3. MOUNTING........................................................................... 7
3.1 Mounting Cautions...........................................................................................7
3.2 Dimensions......................................................................................................8
3.3 DIN Rail Mounting ...........................................................................................9
3.4 Panel Mounting..............................................................................................10
4. WIRING ............................................................................... 11
4.1 Wiring Cautions .............................................................................................11
4.2 Terminal Configuration ..................................................................................12
4.3 Connection to DeviceNet ...............................................................................13
4.3.1 Connection outline of DeviceNet........................................................................ 13
4.3.2 Pin layout of connector....................................................................................... 15
4.4 Wiring to the Controllers ................................................................................17
4.5 Termination Resistor .....................................................................................18
5. SETTING............................................................................. 20
5.1 Node Address Setting....................................................................................20
5.2 DeviceNet Communication Speed Setting.....................................................21
5.3 DIP Switch Setting.........................................................................................22
5.4 Communication Environment Setting by Rotary Switch.................................23