Processor Technology Sol-PC, Руководство пользователя

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PROCESSOR TECHNOLOGY CORPORATION
Sol PERSONALITY MODULE SECTION IV
DAMAGED BY SIATIC ELECTRICITY DISCHARGE.
HANDLE THESE IC’s SO THAT NO DISCHARGE
FLOWS THROUGH THE IC. AVOID UNNECESSARY
HANDLING AND WEAR COTTON, RATHER THAN
SYNTHETIC, CLOTHING WHEN HANDLING MOS
IC’s. (STATIC DISCHARGE PROBLEMS ARE MUCH
WORSE IN LOW HUMIDITY CONDITIONS.)
( ) Step 1. Install DIP sockets. Install each socket in the
indicated location with its end notch oriented as shown on
the circuit board and assembly drawing. Take care not to
create solder bridges between the pins and/or traces.
INSTALLATION TIP
Insert socket pins into mounting pads of
appropriate Location. On back (solder)
side of hoard, bend pins at opposite cor-
ners of socket (e.g. pins 1 and 9 on a
16—pin socket) outward until they are at
a 45 angIe to the board surface. This
secures the socket until it is soldered.
Repeat this procedure with each socket
until all are secured to the board. Then
solder the pins on all sockets.
LOCATION TYPE SOCKET
( ) U1 24 pin
( ) U2* 24 pin*
( ) U3 14 pin
*Used on 2708— 1 vers ion only.
( ) Step 2. Install the following resistors in the indicated
locations. Instal I these resistors parallel with the board.
Bend leads by using needle nose pliers to grip the resistor
lead right next to tlie resistor body, and bend the portion
of the lead on the other side of the pliers with your finger.
The bend must he the right distance from the resistor body
for the resister to Fit easily into its two holes. Insert
the leads into the two holes, and from the opposite side of
the hoard poll the leads to bring the resistor body down to
touch the hoard, head the leads outward on the solder (back)
side of the board so the resistors do not slip out of posi-
tion.
Rev C IV-3