ADuCM320 Hardware Reference Manual
UG-498
Rev. C | Page 39 of 196
IDAC Thermal Shutdown
The
has an internal temperature sensor that monitors the die temperature. This temperature sensor can be monitored as an
ADC input channel; the measured voltage is proportional to die temperature. See the Temperature Sensor Settings section for more
information.
Internally, the die temperature is compared to a fixed voltage, proportional to approximately 130°C die temperature. If the die temperature
exceeds 130°C, there is a risk of damaging the die because the absolute maximum junction temperature rating is 150°C. Because the
IDACs potentially consume the most power, shut off the IDACs to reduce power and therefore to reduce the die temperature. Two
options to enable shutdown include the following:
•
Enable a thermal interrupt by setting either INTSEL[12] or INTSEL[4]. If the die temperature exceeds the threshold of approximately
130°C, this interrupt triggers and user code takes the appropriate action. It is recommended to use this procedure.
•
Enable automatic shutdown of the IDACs by setting the individual thermal shutdown bits for each IDAC via IDACxCON[6]. If this
bit is set in the appropriate IDACxCON register, the IDAC output current reduces to 0 mA, which reduces the power consumption of
the device and the die temperature of the device.
Note that the internal temperature sensor accuracy can be up to ±20°C, and there is no way of calibrating the thermal shutdown trip
point. Therefore, it is recommended that the automatic thermal shutdown feature (IDACxCON[6] = 0) not be enabled.