Olympus AL120-6 Series, Operation Manual, Page: 63 / 80

Operation Manual Specifications
/ AL120-L86, LMB86, L86-180, LMB86-180 and LMB-90
4-5
Page
Item
AL120-
L86
AL120-
L86-180
AL120-
LMB86 AL120-
LMB86-180
AL120-
LMB8-90
2nd Back Macro
inspection
Not available
After the Back Macro inspection, the wafer is rotated
counterclockwise about 20 degrees and inspected
again.
Inspection time setting
Not available
From 0 to 8 seconds and

The

setting maintains the inspection state.
The time can be set in 1 second steps.
Common time setting for the Top Macro and Back
Macro inspections
4. Microscope Inspection
Applicable microscope
OLYMPUS MX61 , MX63
Applicable microscope
stage
AL120-VS8
Microscopic observation
method
Reflected light observation only
Stage operation method
Manually-operated stage with X and Y coarse and fine adjustment and 360-degree rotation
mechanism (with an X-direction coarse travel clutch)
Stage driving method
Belt drive
Microscopic observation
range

200 mm
Stroke below the stage
3 mm below the observation position
Wafer table
Conductive PEEK resin
Wafer holding method
Vacuum adsorption (Vacuum is supplied by the loader)
5. Inspection Mode
All (100%) inspection
Continuous transfer (Two wafers are transferred at a time)
Sampling transfer
patterns
10 patterns (P1 to P10) can be registered.
Transfer of specified wafers (Two wafers at a time are transferred) (When a wafer is being
inspected under the microscope, the next wafer is being transferred to the macro (center)
table position.)
Sampling inspection
patterns
Not available
10 patterns (P1 to P10) can be registered.
Transfer and inspection of specified wafers (One
wafer at a time is transferred)
Automatic skip function
Slots with no wafer are automatically skipped in both All and Sampling modes.
6. Auxiliary Functions during Inspection
Wafer registration
Numbers of defective wafers registered in each type of inspection can be displayed.
Pause
Not available
When the inspection time is set to 0 to 8 seconds, it
can be extended by pausing the loader.
Wafer removal
Wafers can be removed by using tweezers or similar tools during inspection.
Orientation flat alignment
Non-contact detection using the opto-sensor
Four orientation flat positions (the near, far, right and left sides) can be selected on the
microscope stage at 90-degree intervals.
Settings can be changed during inspection. (The position specified before the orientation
flat alignment is effective.)
Orientation flat alignment during unloading: Can be set using the memory button. (Settings
can be changed during inspection.)
Wafer alignment Contactless alignment (optical)
7. Protective Functions
Immediate stoppage
Transfer is stopped by pressing the Loader Stop button (with the switch guard to prevent
wrong operation).