REL1.3
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RZ/G1M/G1N Qseven SOM Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Figure 14: Mechanical dimension of RZ/G1M/G1N Qseven SOM- Bottom View
RZ/G1M/G1N Qseven SOM PCB thickness is 1.2mm±0.15mm, top side maximum height component is Power Inductor
L1 (3.10mm±0.15mm) and bottom side maximum height component is expansion connector (4.20mm±0.15mm)
followed by bulk capacitors (1.5mm±0.15mm). Please refer the below figure which gives height details of the
RZ/G1M/G1N Qseven SOM.
Figure 15: Mechanical dimension of RZ/G1M/G1N Qseven SOM- Side View
Note: If Optional features are considered in RZ/G1M/G1N Qseven SOM, top side maximum height component is SPI
programming Header (3.2mm±0.15mm) followed by JTAG header (3.12mm±0.15mm).
