Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
71
Retention Assembly Mechanical Drawings
E
Retention Assembly
Mechanical Drawings
Table E-1
lists the mechanical drawings included in this appendix.
Table E-1.
Mechanical Drawing List (Sheet 1 of 2)
Description
Figure
Backplate Assembly, 1/3
Figure E-1
Backplate Assembly, 2/3
Figure E-2
Backplate Assembly, 3/3
Figure E-3
Bolster Plate Assembly and Dust Cover
Figure E-4
Bolster Plate Assembly, 1/2
Figure E-5
Bolster Plate Assembly, 2/2
Figure E-6
Heatsink Module Clip (non-Fabric), 1/2
Figure E-7
Heatsink Module Clip (non-Fabric), 2/2
Figure E-8
Heatsink Module Clip (Fabric), 1/2
Figure E-9
Heatsink Module Clip (Fabric), 2/2
Figure E-10
Backplate
Figure E-11
Backplate Insulator
Figure E-12
Back Plate, M3 Stud
Figure E-13
Bolster Plate, 1/2
Figure E-14
Bolster Plate, 2/2
Figure E-15
Bolster Plate, Insulator
Figure E-16
Bolster Plate, Small Guide Post
Figure E-17
Bolster Plate, Large Guide Post
Figure E-18
Bolster Plate, LEC Guide Pin
Figure E-19
Bolster Plate, Corner Standoff
Figure E-20
Bolster Plate, Spring Assembly
Figure E-21
Bolster Plate, Spring
Figure E-22
Bolster Plate, Spring Stud, M4
Figure E-23
Bolster Plate, Spring Rivet
Figure E-24
Bolster Plate, M3 Captive Nut
Figure E-25
Bolster Plate, M3 Captive Nut Collar
Figure E-26
Socket-P, Dust Cover, 1/2
Figure E-27
Socket-P, Dust Cover, 2/2
Figure E-28
1U Heatsink Assembly, 1/2 (Reference Only)
Figure E-29
1U Heatsink Assembly, 2/2 (Reference Only)
Figure E-30
1U Heatsink, 1/2 (Reference Only)
Figure E-31
1U Heatsink, 2/2 (Reference Only)
Figure E-32
1U Heatsink, Label (Reference Only)
Figure E-33
