Figure 3-3. Socket-P1 and Bolster Plate Assembly Alignment Features
Bolster Plate
Small Coarse (Gross)
Alignment Post
Bolster Plate
Large Coarse (Gross)
Alignment Post
Bolster Plate
Heatsink Leveling Stud
Socket-P1 Key
Pin A1
Socket Wall
Alignment Features
Socket Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
Order Number: 334785-002
24
The socket also has two orientation posts or protrusions (keys) placed on opposite
sides of the socket as noted in
. The package substrate will have keying
notches at the corresponding locations. When package keying notches align with socket
orientation posts, it prevents the package from being mistakenly installed with a 180
°
in-plane rotation (also refer to
). The package sits flush on the socket
contacts when aligned.
Figure 3-4. Socket-P1, Mechanical Retention Assembly and PHM Alignment
