Thermal Specifications and Design Guidelines
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
Order Number: 334785-002
48
6.1.4
Storage Conditions Specifications
Environmental storage condition limits define the temperature and relative humidity
limits to which the device is exposed while being stored in a moisture barrier bag. the
specified storage conditions are for component level prior to board installation.
specifies absolute maximum and minimum storage temperature limits which
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. At conditions outside sustained
limits, but within absolute maximum and minimum ratings, quality, and reliability may
be affected.
Table 6-4.
Storage Condition Ratings
Symbol
Parameter
Min.
Max.
Unit
Time
sustained storage
A prolonged or extended period of time; typically
associated with sustained storage conditions.
Unopened bag, includes 6 months storage time by
customer.
0
30
months
Time
short term storage
A short period of time (in shipping media).
0
72
hours
T
absolute storage
The minimum/maximum device storage temperature
beyond which damage (latent or otherwise) may
occur when subjected to for any length of time.
-25
125
°C
T
sustained storage
The minimum/maximum device storage temperature
for a sustained period of time.
-5
40
°C
T
short term storage
The ambient storage temperature (in shipping media)
for a short period of time.
-20
85
°C
RH
sustained storage
The maximum device storage relative humidity for a
sustained period of time.
60% @ 24
°C
6.1.5
Reference Design Thermal Interface Material (TIM)
Applying thermal interface material between the processor IHS and the heatsink base
will improve the heat transfer between the IHS and the heatsink. Honeywell* PCM45F
material is selected for use with the Intel reference heatsink design.
The recommended size ensures adequate coverage at the interface between the
processor IHS and heatsink pedestal.
Table 6-5.
TIM Specification
Parameter
Value
Unit
Notes
TIM Size
47 x 70 x 0.25
mm
Dimensions apply to Honeywell* PCM45F p/n: H38442
PCM45F Activation Load
340
N
Load required to meet min. TIM pressure (15 psi)
Refer to the TIM manufacturer’s guidelines for specifications and handling instructions.
