Figure 2-6. Processor with Fabric Top and Bottom View
Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
17
Processor Mechanical Design
2.7
Processor Mechanical Load Specification
and
for the mechanical loading specifications.
2.8
Processor Insertion Specification
Socket Insertion Cycling:
• The processor can be inserted into and removed from an LGA3647-1 socket 30
times.
IFP Cable Attachment Cycling (processor with fabric only):
• Mating and unmating of the processor package and the Linear Edge Connector
(LEC54A) on the Intel Fabric Passive (IFP) cable limit is 15 cycles.
2.9
Processor Handling Guidelines
The processor package may contain components on the top or bottom side of the
package substrate. To remove the processor from its shipping container or the tray,
grab and hold the processor along its long edges.
Avoid contacting the processor bottom side lands and/or gold fingers, and always use
Electrostatic Discharge (ESD) protective procedures and equipment.
