Intel Xeon Phi Processor x200, Thermal/Mechanical Specification And Design Manual

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Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
19
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Socket Mechanical Design
3
Socket Mechanical Design
3.1 LGA3647-1 Socket Overview
This section describes the Surface Mount (SMT) Land Grid Array (LGA) socket for the
processor. The socket contains 3647 pins and provides I/O, power, and ground
connections from the main board to the processor package.
Socket definitions listed in this section are provided for design guidance only. Contact
vendors for explicit and detailed design guidance. Socket vendor contact information is
provided in
Appendix B .
The socket has four main components, the two halves comprising the socket body and
the Pick-and-Place (PnP) covers for each half. The socket set is delivered by the
supplier with PnP covers attached to each appropriate half of the socket body. The main
body of the socket, which is made of electrically insulated material with resistance to
high temperature, houses the socket contacts. Key components of the socket are the
main body of the socket, socket contacts, surface mount features, and the protective
covers.
Due to the large size of the socket, it is made of two C-shaped halves. The two halves
are not interchangeable and are distinguishable from one another by the keying colors
and by the pin A1 indicator: The left half keying insert (can be molded) is the same
color as the body; the right half keying insert is white; and the right half also has a
molded chamfer for pin A1.
Figure 3-1 illustrates the socket features. Keying features
(wall protrusions) within the contact array area and raised edges of the socket body
help align the package with respect to the socket contacts.