Figure E-8. Heatsink Module Clip (non-Fabric), 2/2
1
3
4
5
6
7
8
B
C
D
A
1
2
3
4
5
6
7
8
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
82.5
62.5
R0.5
R0.5
7.97±0.1
9.97±0.1
A
H53249
2
10
DWG. NO
SHT.
REV
SHEET 2 OF 2
DO NOT SCALE DRAWING
SCALE: 2:1
10
H53249
D
REV
DRAWING NUMBER
SIZE
DEPARTMENT
4
8
11
Retention Assembly Mechanical Drawings
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
Order Number: 334785-002
80
