Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
59
Supplier Listing
Bolster Plate
Assembly
Bolster plate, posts, leaf
spring assembly and
insulator.
Intel P/N
Lotes P/N
Foxconn P/N
H77470-008
AZIF0085-P002C*
WNMEL60-80N05-EH
Back Plate
Assembly
Back plate, threaded posts
and insulator
Intel P/N
Lotes P/N
Foxconn P/N
H77469-002
AHSK0009-P002C*
PT44P12-4801
Dust Cover
Skt-P plastic handling cover
Intel P/N
Lotes P/N
Foxconn P/N
H77975-005
AZIF0084-P002C*
WNMEL00-81N00-EH
Bolster Plate
with Dust Cover
Assembly
Bolster plate, posts, leaf
spring assembly and
insulator, Skt-P plastic
handling cover
Intel P/N
Lotes P/N
Foxconn P/N
H78747-008
AZIF0086-P002C*
PT44L12-4811
Bolster Plate,
Back Plate and
Dust Cover
Assembly
Bolster plate, posts, leaf
spring assembly and
insulator, back plate,
threaded posts, insulator and
Skt-P plastic handling cover
Intel P/N
Foxconn P/N
NA
WNMEA66-81N02-EH
Table B-1. Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part
Information
Component
Description
Supplier P/N
Supplier Contact Info
