Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
47
Thermal Specifications and Design Guidelines
.
Figure 6-3. Psi Curves for the Reference Thermal Solution (Mean+3 Sigma)
Psi-mm = 0.0603+0.8778*cfm
-0.6724
Psi-cm = 0.0277+0.8159*cfm
-0.6806
Psi-mc = 0.0349+0.9174*cfm
-0.7015
Psi-cc = 0.1031+0.8235*cfm
-0.6752
Psi-cf = 0.0294+1.0777*cfm
-0.7596
Psi-mf = 0.0674+0.8705*cfm
-0.6375
6.1.3
Socket Maximum Temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the main board. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket must be <95 °C.
• The specific via used for temperature measurement is located on the bottom of the
motherboard between pins BN6 and BJ6.
• The socket maximum temperature is defined at Thermal Design Current (TDC). In
addition, the heatsink performance targets and boundary conditions must be met
to limit power and thermal dissipation through the socket.
To measure via temperature:
• Drill a hole through the back plate corresponding to the location of pins BN6 and
BJ6.
• Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the
specific measurement via on the underside of the motherboard.
• Once the glue dries, reinstall the back plate and measure the temperature.
