Intel Xeon Phi Processor x200, Thermal/Mechanical Specification And Design Manual

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
Introduction
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
10
1.4 Terminology
Table 1-2 provides a list of common terms used in this document, along with a brief
description.
Table 1-2. Terms and Terminology (Sheet 1 of 2)
Terms Terminology
BOL Beginning of Life, initial time period relevant to product quality and reliability testing
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For
this example, it can be expressed as a dimension away from the outside dimension of the fins
to the nearest adjacent surface.
DTS Digital Thermal Sensor: On-die circuit used for estimating local die temperature which is then
converted to a digital value.
EOL End of Life, final time period relevant to product quality and reliability testing
FSC Fan Speed Control, algorithms developed to optimize cooling vs air flow vs acoustics, etc.
IFP Cable Intel
®
Fabric Passive (IFP) internal cable assembly enables high speed, low loss data
connections between the Intel processor and chassis connections to an external fabric
interface.
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
KOZ Component Keep-Out Zone usually provided for a board or system to avoid mechanical
interference or performance problems.
LEC54A Linear Edge Connector 54 pin, high speed, low loss, edge connector designed specifically for
Intel Xeon
®
Phi processors with integrated fabric interconnects.
LGA Land Grid Array processor package and socket interface
MCDRAM Multi-Channel Dynamic Random Access Memory
PECI Platform Environment Control Interface, standard for thermal management using DTS, is a
one-wire interface that provides a communication channel between Intel processor and
chipset components and external monitors.
PHM Processor - Heatsink - Module

CA
Case-to-ambient thermal resistance, a thermal performance characterization parameter
(Psi_CA). A measure of thermal solution performance using total package power.
Defined as (T
CASE
– T
LA
) / (Total Package Power).
T
CASE
is the IHS temperature at a specific location and T
LA
is the local ambient air
temperature. The heat source should always be specified for

measurements. The unit is
°
C/W.

CS
Case-to-sink thermal resistance, a thermal performance characterization parameter. A
measure of thermal interface material performance using total package power.
Defined as (T
CASE
– T
SINK
) / (Total Package Power).

SA
Sink-to-ambient thermal resistance, a thermal performance characterization parameter. A
measure of heatsink thermal performance using total package power.
Defined as (T
SINK
– T
LA
) / (Total Package Power).
SKU A processor Stock Keeping Unit (SKU) to be installed in either server or workstation platforms.
For the Intel
®
Xeon Phi™ Processor x200 Product Family, different SKUs will be distinguished
by different marketing names and offer e.g., different numbers of cores, clock frequencies,
etc.
SMT Surface Mount Technology
SRO Solder Resist Opening.
T
CASE
The case temperature of the processor measured at specific locations on the topside of the
IHS, this is typically above the geometric center of a particular die (but may not coincide with
the geometric center of the IHS).
T
CONTROL
T
CONTROL
is a static temperature setting used as a trigger point for fan speed control.