Processor Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
Order Number: 334785-002
16
2.4
Processor Mass
The processor mass is 88.8 g, and the processor with fabric mass is 91.4 g. This
includes the mass of all components integrated on the processor package.
2.5
Processor Material
The table below lists some of the package components and associated materials.
Table 2-1.
Processor Materials
Component
Material
Integrated Heat Spreader
Nickel Plated Copper
Substrate
Halogen Free, Fiber Reinforced Resin
Package Lands
Gold Plated Copper
Fabric Edge Connector Fingers
Gold Plated Copper
2.6
Processor Markings
for detailed information on package surface mark and enabling mark
zones.
Figure 2-5. Processor Top and Bottom View
