Processor Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
Order Number: 334785-002
12
2
Processor Mechanical Design
2.1
Processor Package Mechanical Specifications
This section provides an overview of the processor package mechanical design and
integration. The package serves as the primary interface between the processor silicon
die and the rest of the system. The package provides electrical signaling and power
delivery as well as thermal transmission, mechanical physical attach, dimensional scale
translation and structural strength and stiffness. A solid understanding of the processor
design targets provides the necessary foundation to identify and establish thermal and
mechanical design requirements for the main board and the system.
To ensure compatibility with the processor and the Intel Xeon Phi Processor x200
Product Family-based platform, the mechanical processor retention and thermal
solution must meet the requirements and keep-out zones of both the processor and the
LGA3647-1 socket. This section provides specific package-related thermal and
mechanical design guidance.
2.2
Processor Package Description
The processor is a multi-chip package consisting of the processor silicon die and eight
MCDRAM chips, all housed in a Flip Chip (FC) Land Grid Array (LGA) package that
interfaces with the main board via an LGA3647-1 socket. The package incorporates an
Integrated Heat Spreader (IHS) attached to the top surface of the package substrate.
The processor die and MCDRAMs are mounted on the substrate beneath the IHS and
are thermally connected to the IHS via Thermal Interface Material (TIM).
The package IHS serves as the mating surface (interface) for the processor thermal
cooling solution, such as a heatsink or cold plate. The IHS transfers the non-uniform
heat from the die surface to the TIM on the base of the heatsink or cold plate, resulting
in a heat flux that is more uniform and spread over a larger surface area (though not
the entire IHS area). This allows more efficient heat transfer out of the package to an
attached cooling device.
The bottom side of the package has 3647 lands arranged in a hexagonal pad array
which interfaces with the LGA3647-1 socket.
sectional sketches of the processor package components and how they are assembled.
The package components include the following:
• Processor die
• MCDRAMs
• Fabric die (processor with fabric only)
• Package substrate
• Thermal Interface Material (TIM)
• Integrated Heat Spreader (IHS)
• LGA lands (LGA3647-1 socket interface)
• Discrete components (top side)
• Discrete components (bottom side)
