Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
53
Quality and Reliability Requirements
A
Quality and Reliability
Requirements
A.1
Thermal/Mechanical Solution Stress Test
Intel evaluates reliability performance based on the use conditions (operating
environment) of the end product by using acceleration models.
The use condition environment definitions provided in the tables below are based on
speculative use condition assumptions, and are provided as examples only.
Based on the system enabling boundary condition, the solder ball temperature can vary
and needs to be comprehended for reliability assessment.
Table A-1. Example Thermal Stress Test: Use Condition Environment Definitions
Use Environment
Speculative
Stress
Condition
Example
Use Condition
Example
7 yr. Stress
Equivalent
Example
10 yr. Stress
Equivalent
Purpose/
Failure
Mechanism
Slow small internal gradient changes
due to external ambient
(temperature cycle or externally
heated)
Fast, large gradient on/off to max
operating temperature (power cycle
or internally heated including power
save features)
Temperature
Cycle
DT = 35 - 44 °C
(solder joint)
550-930 cycles
Temp Cycle
(-25 °C to 100
°C)
780-1345 cycles
Temp Cycle
(-25 °C to 100
°C)
Solder joint
fatigue, via
barrel cracking,
and Thermal
Interface
Material (TIM)
separation/
disbond under
thermal
mechanical
stresses
High ambient moisture during low-
power state (operating voltage)
THB/HAST
T = 25 - 30 °C
85% RH
(ambient)
110-220 hrs
at 110 °C and
85% RH
145-240 hrs
at 110 °C and
85% RH
Corrosion and
material
migration
induced by
moisture/
temperature
High Operating temperature and
short duration high temperature
exposures
Bake
T = 95 - 105 °C
(contact)
700 - 2500 hrs
at 125 °C
800 - 3300 hrs
at 125 °C
Creep-induced
failure
mechanisms,
for example
contact
relaxation,
solder ball
creep, and
thermal TIM
degradation
Material used will not have deformation or degradation in a temperature life test.
