Intel Xeon Phi Processor x200, Thermal/Mechanical Specification And Design Manual

Page: 9 / 114

Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
9

Introduction
— Reference designs for the Processor Heatsink Module (PHM).
• Board and system integration and design guidance.
• Processor thermal specifications and design guidance, reference board and
reference air-cooled thermal solution (which includes the reference heatsink).
Thermal and mechanical design aspects which directly impinge on the processor
package and the socket (by extension) must be treated as design specifications.
Consideration of mechanical retention assembly loading targets and physical design
attributes as specification or recommendation depends on the degree to which the user
adopts the reference design.
The purpose of this specification and design guide is to describe and document these
design requirements, as well as the mechanical retention approach and the reference
thermal solution from Intel, for the processor. Guidelines for designing a thermal
solution that meets product lifetime requirements will also be discussed.
This document is intended for use by:
• Board and system thermal and mechanical designers.
• Designers and suppliers of processor thermal solutions.
The guidelines recommended in this document are based on experience and simulation,
and preliminary work done at Intel while developing the processor. This work is ongoing
and the recommendations and specifications are subject to change.
1.3 References
Table 1-1 lists additional resources to assist with processor mechanical and thermal
design solutions. For a complete list of documentation, contact your local Intel
representative or go to www.intel.com .
Table 1-1. Related Documents
Document
Document
Number
Notes
Intel
®
Xeon Phi™ Processor x200 Product Family Datasheet, Volume One: Electrical 334710 1
Intel
®
IA64 IA32 Architecture Software Developers Manual 325462 2
European Blue Angel Recycling Standards
3
Environmental Product Content Specification for Suppliers and Outsourced
Manufacturers
18-1201 4
Notes:
1. Available at http://www.intel.com/content/www/us/en/processors/xeon/xeon-phi-processor-x200-product-
family-datasheet.html
2. Available at http://www.intel.com/content/dam/www/public/us/en/documents/manuals/64-ia-32-
architectures-software-developer-manual-325462.pdf
3. Available at https://www.blauer-engel.de/
4. Available at https://supplier.intel.com/static/EHS/Environmental_Product_Content_Specification.pdf