Figure E-32. 1U Heatsink, 2/2 (Reference Only)
A
A
1
3
4
5
6
7
8
B
C
D
A
1
2
3
4
5
6
7
8
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
0.12
A
B
C
1B
C
0.12
A
B
C
B
0.12
A
C
0.12
A
B
72
2X
8.2
1.5
6.2
0.1
23.5±0.12
11±0.12
7±0.12
1.5±0.12
8.2
8.1
4X R2
0.3
95
8.2
6.2
6.2
10.1
7°
7°
1.01±0.3
5.5
7.5
2X R2.75
9.5
7.5
2X R3.75
10.5
68
2X
8.2
2.0
6.2
0.1
3
3
47
70
A
A
A
2X (2.5)
2X (3.0)
G97766
2
N
DWG. NO
SHT.
REV
SHEET 2 OF 2
DO NOT SCALE DRAWING
SCALE: 2:1
N
G97766
D
REV
DRAWING NUMBER
SIZE
DEPARTMENT
CHAMFER ALL FINS
THE NOTCH WOULD BE 0.2MM MAX DEEPER
THAN OUTBOARD GROOVE SURFACE
SEE DETAIL D
SEE DETAIL E
2X
2X
SEE DETAIL G
SEE DETAIL H
SEE DETAIL C
SCALE 4:1
2X DETAIL D
SCALE 4:1
2X DETAIL E
SECTION A-A
SEE DETAIL F
SCALE 4:1
DETAIL F
SCALE4:1
DETAIL G
SCALE 4:1
DETAIL H
SCALE 4:1
DETAIL C
C
C
C
C
C
0.077
LOCAL FLATNESS ZONE,
SEE NOTE 5
Retention Assembly Mechanical Drawings
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
Order Number: 334785-002
104
