Intel Xeon Phi Processor x200, Thermal/Mechanical Specification And Design Manual

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Figure 3-1. LGA3647-1 Socket Assembly with PnP Covers

Socket Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
20
3.1.1 Socket Features
LGA3647-1 socket attributes are listed in Table 3-1 . The socket incorporates a roughly
rectangular pin grid with a hexagonal depopulation region in the center of the array and
selective depopulation elsewhere; see
Appendix D . The pin field geometry is a
hexagonal array as shown in Figure 3-2 below. The tips of the socket pin contacts
extend above the surface of the socket to make contact with the pads located at the
bottom of the processor package.
Solder balls enable the socket to be surface-mounted to the main board. Each contact
has a corresponding solder ball. Solder ball position may be at an offset with respect to
the contact tip and base. Socket BGA ball hexagonal array ball-out pattern shown in
Figure 3-2 increases contact density by 12% while maintaining 39 mil minimum via
pitch requirements.
Table 3-1. LGA3647-1 Socket Attributes
LGA3647-1 Socket Attributes
Socket Wall Exterior Dimension 82 mm (L) x 62 mm (W)
Socket Wall Interior Dimension (Package Size) 76.16 mm (L) x 56.6 mm (W)
Pitch (hexagonal pattern) 0.8585 mm (X) x 0.9906 mm (Y)
Ball Count 3647