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2-Mbit (128K x 16) Static RAM

CY62136EV30

MoBL

®

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05569 Rev. *B

 Revised January 6, 2006

Features

• Very high speed: 45 ns

• Wide voltage range: 2.20V–3.60V

• Pin-compatible with CY62136CV30

• Ultra low standby power

— Typical standby current: 1

µ

A

— Maximum standby current: 7

µ

A

• Ultra-low active power

—  Typical active current: 2 mA @ f = 1 MHz

• Easy memory expansion with CE, and OE features

• Automatic power-down when deselected

• CMOS for optimum speed/power

• Offered in a Pb-free 48-ball VFBGA and 44-pin TSOP II 

packages

Functional Description

[1]

The CY62136EV30 is a high-performance CMOS static RAM
organized as 128K words by 16 bits. This device features
advanced circuit design to provide ultra-low active current.
This is ideal for providing More Battery Life™ (MoBL

®

) in

portable applications such as cellular telephones. The device
also has an automatic power-down feature that significantly
reduces power consumption by 80% when addresses are not
toggling. The device can also be put into standby mode
reducing power consumption by more than 99% when
deselected (CE HIGH). The input/output pins (I/O

0

 through

I/O

15

) are placed in a high-impedance state when: deselected

(CE HIGH), outputs are disabled (OE HIGH), both Byte High
Enable and Byte Low Enable are disabled (BHE, BLE HIGH),
or during a write operation (CE LOW and WE LOW).

Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O

0

 through I/O

7

), is

written into the location specified on the address pins (A

0

through A

16

). If Byte High Enable (BHE) is LOW, then data

from I/O pins (I/O

8

 through I/O

15

) is written into the location

specified on the address pins (A

0

 through A

16

).

Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O

0

 to I/O

7

. If Byte High Enable (BHE) is

LOW, then data from memory will appear on I/O

8

 to I/O

15

. See

the truth table at the back of this data sheet for a complete
description of read and write modes. 

Note: 

1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.

Logic Block Diagram

128K x 16

RAM Array

I/O

0

–I/O

7

ROW D

E

CODER

 

A

8

A

7

A

6

A

5

A

2

COLUMN DECODER

A

11

A

12

A

13

A

14

A

15

SENSE AMPS

DATA IN DRIVERS

OE

A

4

A

3

I/O

8

–I/O

15

CE

WE

BLE

BHE

A

16

A

0

A

1

A

9

A

10

[+] Feedback 

Summary of Contents for CY62136EV30 MoBL

Page 1: ... O15 are placed in a high impedance state when deselected CE HIGH outputs are disabled OE HIGH both Byte High Enable and Byte Low Enable are disabled BHE BLE HIGH or during a write operation CE LOW and WE LOW Writing to the device is accomplished by taking Chip Enable CE and Write Enable WE inputs LOW If Byte Low Enable BLE is LOW then data from I O pins I O0 through I O7 is written into the locat...

Page 2: ...n Operating ICC mA Standby ISB2 µA f 1MHz f fmax Min Typ 4 Max Typ 4 Max Typ 4 Max Typ 4 Max CY62136EV30LL 2 2 3 0 3 6 45 2 2 5 15 20 1 7 WE A11 A10 A6 A0 A3 CE I O10 I O8 I O9 A4 A5 I O11 I O13 I O12 I O14 I O15 VSS A9 A8 OE Vss A7 I O0 BHE NC NC A2 A1 BLE VCC I O2 I O1 I O3 I O4 I O5 I O6 I O7 A15 A14 A13 A12 NC NC NC 3 2 6 5 4 1 D E B A C F G H A16 NC Vcc WE 1 2 3 4 5 6 7 8 9 10 11 14 31 32 36 ...

Page 3: ...4 V VIH Input HIGH Voltage VCC 2 2V to 2 7V 1 8 VCC 0 3 V VCC 2 7V to 3 6V 2 2 VCC 0 3 V VIL Input LOW Voltage VCC 2 2V to 2 7V 0 3 0 6 V VCC 2 7V to 3 6V 0 3 0 8 V IIX Input Leakage Current GND VI VCC 1 1 µA IOZ Output Leakage Current GND VO VCC Output Disabled 1 1 µA ICC VCC Operating Supply Current f fMAX 1 tRC VCC VCCmax IOUT 0 mA CMOS levels 15 20 mA f 1 MHz 2 2 5 ISB1 Automatic CE Power down...

Page 4: ...teristics Over the Operating Range 8 9 Parameter Description Conditions Min Typ 4 Max Unit VDR VCC for Data Retention 1 0 V ICCDR Data Retention Current VCC 1 0V CE VCC 0 2V VIN VCC 0 2V or VIN 0 2V 0 8 3 µA tCDR 8 Chip Deselect to Data Retention Time 0 ns tR 9 Operation Recovery Time tRC ns VCC VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90 10 90 10 Rise Time 1 V ns Fall Time 1 V ns OUTPUT VT...

Page 5: ... LOW to Write End 35 ns tSD Data Set Up to Write End 25 ns tHD Data Hold from Write End 0 ns tHZWE WE LOW to High Z 11 12 18 ns tLZWE WE HIGH to Low Z 11 10 ns Notes 10 Test conditions for all parameters other than tri state parameters assume signal transition time of 3 ns 1V ns or less timing reference levels of VCC typ 2 input pulse levels of 0 to VCC typ and output loading of the specified IOL ...

Page 6: ...ontinuously selected OE CE VIL BHE and or BLE VIL 15 WE is HIGH for read cycle 16 Address valid prior to or coincident with CE and BHE BLE transition LOW ADDRESS DATA OUT PREVIOUS DATA VALID DATA VALID tRC tAA tOHA 50 50 DATA VALID tRC tACE tLZBE tLZCE tPU DATA OUT HIGH IMPEDANCE IMPEDANCE ICC ISB tHZOE tHZCE tPD OE CE HIGH VCC SUPPLY CURRENT tHZBE BHE BLE tLZOE ADDRESS tDBE tDOE Feedback ...

Page 7: ...IGH simultaneously with WE VIH the output remains in a high impedance state 19 During this period the I Os are in output state and input signals should not be applied Switching Waveforms continued 14 15 tHD tSD tPWE tSA tHA tAW tWC DATA I O ADDRESS CE WE OE tHZOE DATAIN NOTE19 BHE BLE tBW tSCE tHD tSD tPWE tHA tAW tSCE tWC tHZOE DATAIN CE ADDRESS WE DATA I O OE NOTE 19 BHE BLE tBW tSA Feedback ...

Page 8: ... LOW 18 Write Cycle No 4 BHE BLE Controlled OE LOW 18 Switching Waveforms continued 14 15 DATAIN tHD tSD tLZWE tPWE tSA tHA tAW tSCE tWC tHZWE CE ADDRESS WE DATAI O NOTE 19 tBW BHE BLE DATA I O ADDRESS tSD tSA tHA tAW tWC CE WE DATAIN NOTE 19 tBW BHE BLE tSCE tPWE tHZWE tHD tLZWE Feedback ...

Page 9: ...ICC L H H H L High Z Output Disabled Active ICC L H H L H High Z Output Disabled Active ICC L L X L L Data In I OO I O15 Write Active ICC L L X H L Data In I OO I O7 I O8 I O15 in High Z Write Active ICC L L X L H Data In I O8 I O15 I O0 I O7 in High Z Write Active ICC Ordering Information Speed ns Ordering Code Package Diagram Package Type Operating Range 45 CY62136EV30LL 45BVXI 51 85150 48 ball ...

Page 10: ...8X Ø0 25 M C A B Ø0 05 M C B A 0 15 4X 0 21 0 05 1 00 MAX C SEATING PLANE 0 55 MAX 0 25 C 0 10 C A1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 3 75 5 25 B C D E F G H 6 5 4 6 5 2 3 1 D H F G E C B A 6 00 0 10 8 00 0 10 A 8 00 0 10 6 00 0 10 B 1 875 2 625 0 26 MAX 48 pin VFBGA 6 x 8 x 1 mm 51 85150 51 85150 D Feedback ...

Page 11: ...ursuant to an express written agreement with Cypress Furthermore Cypress does not authorize its products for use as critical components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress products in life support systems application implies that the manufacturer assumes all risk of such use and in do...

Page 12: ...A to 15 mA at f fmax Changed ISB1 and ISB2 Typ values from 0 7 µA to 1 µA and Max values from 2 5 µA to 7 µA Changed the AC test load capacitance from 50pF to 30pF on Page 4 Changed VDR from 1 5V to 1V on Page 4 Changed ICCDR from 2 5 µA to 3 µA Added ICCDR typical value Changed tOHA tLZCE and tLZWE from 6 ns to 10 ns Changed tLZBE from 6 ns to 5 ns Changed tLZOE from 3 ns to 5 ns Changed tHZOE tH...

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