Figure E-13. Back Plate, M3 Stud
1
3
4
5
6
7
8
B
C
D
A
1
2
3
4
5
6
7
8
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
0.24
A
B
6.72±0.127
3.6
0
-0.2
2.2 MAX
3.59±0.05
CHAMFER 0.31 x 45
ALL AROUND
A
H12853
1
07
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 16:1
07
H12853
D
REV
DRAWING NUMBER
SIZE
SKT P M3 BACKPLATE STUD, SHORT
TITLE
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
-
DATE
APPROVED BY
09/11/15
DATE
CHECKED BY
08/14/13
DATE
DRAWN BY
08/14/13
DATE
DESIGNED BY
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-
01
TOOLING RELEASE
08/20/14
02
1. INCREASE STUD LENGTH TO 7MM.
2. ADDED CTF FOR THREADS TO BE ROLLED NOT CUT.
12/1/14
03
1. DECREASED STUD LENGTH FROM 7MM TO 6.334MM.
2. UPDATED NOTES.
3/26/15
04
1. CHANGED NOTE 4 CRITICAL TO FUNCTION SYMBOL.
4/23/15
05
1. UPDATED NOTES.
9/11/15
B8
06
1. CHANGED THE HEIGHT FROM 6.334 TO 6.72
2. PART NUMBER ROLLED FROM H12853-003 TO H12583-004.
2/11/16
A7
07
1. REMOVED CTF DIMENSIONS.
7/11/16
NOTES:
1. REFERENCE DOCUMENTS
ASME Y14.5-2009-STANDARD DIMENSION AND TOLERANCES
UL 1439 - UL SHARP EDGE TESTING
2. FEATURES NOT SPECIFIED ON DRAWING WITHOUT SPECIFIED
TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE. FOR
FEATURES NOT EXPLICITLY TOLERANCED: (BASIC DIMENSIONS
FROM THE 3D CAD MODEL):
3. MATERIAL:
- SUS 416
- CRITICAL MECHANICAL PROPERTIES: 400 MPa MIN
- PROCESS TEST: 168 HRS 85
C / 85% HUMIDITY WITH NO
VISIBLE CORROSION
4. DIMENSIONS MARKED ARE CRITICAL TO FUNCTION
DIMENSIONS (CTF).
5 FEATURE DETAIL PER VENDOR SPECIFICATION
MUST MEET DURABILITY SPECIFICATIONS DEFINED IN
ASSEMBLY DRAWING
6. REFERENCE AND NON-DIMENSIONED FEATURES MAY BE MODIFIED
PER INTEL APPROVAL
M3x0.5 CLASS 6g EXTERNAL"ROLLED"
THREAD
5 FEATURE DEFINED BY PRESS FIT
IN ASSEMBLY.
C
C
C
B
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
SKT P M3 BACKPLATE STUD, SHORT
H12853-004
TOP
Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
85
Retention Assembly Mechanical Drawings
