Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
99
18.
Place a 3
rd
piece of tape at the end of the step in the groove as shown in
7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
19.
Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section
Figure
7-23. Measuring Resistance Between Thermocouple and IHS
20.
Using a fine point device, place a small amount of flux on the thermocouple bead.
Be careful not to move the thermocouple bead during this step (Figure
Ensure the flux remains in the bead area only.
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
