ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
57
Figure
6-2. E18764-001 Reference Design – Exploded View
Figure
6-3. Bottom View of Copper Core Applied by TC-1996 Grease
The ATX motherboard keep-out and the height recommendations defined Section
remain the same for a thermal solution for the processor in the 775-Land LGA
package.
Note:
If this fan design is used in your product and you will deliver it to end use customers,
you have the responsibility to determine an adequate level of protection (e.g.,
protection barriers, a cage, or an interlock) against contact with the energized fan by
the user during user servicing.
Note:
Development vendor information for the reference design is provided in
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
