ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
65
6.7
Reference Attach Mechanism
6.7.1
Structural Design Strategy
Structural design strategy for the reference design is to minimize upward board
deflection during shock to help protect the LGA775 socket.
The reference design uses a high clip stiffness that resists local board curvature under
the heatsink, and minimizes, in particular, upward board deflection (Figure
6-6). In
addition, a moderate preload provides initial downward deflection.
Figure
6-6. Upward Board Deflection During Shock
The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined target
for reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. The
nominal preload provided by the reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb].
Note:
Intel reserves the right to make changes and modifications to the design as necessary
to the reference design, in particular the clip and fastener.
Less curvature in
region under stiff clip
Shock Load
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
