Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
101
Figure
7-26. Positioning Solder on IHS
23.
Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section
D.5.1.step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3
Solder Process
24.
Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature.
25.
Verify the temperature of the Heater block station has reached 155 °C ±5 °C
before you proceed.
26.
Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
