LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines
77
Figure
7-6. Board Deflection Definition
d1
d2
d’1
d’2
A.2.3
Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
d_BOL - d_ref
≥
0.09 mm and d_EOL - d_ref
≥
0.15 mm
And
d’_BOL – d’_ref
≥
0.09 mm and d_EOL’ – d_ref’
≥
0.15 mm
NOTES:
1.
The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2.
Board deflection should not exceed motherboard manufacturer specifications.
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
