Intel Celeron Dual-Core E1000 Series, Design Manuallines

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Thermal and Mechanical Design Guidelines 5
A.2.1 Heatsink Preload Requirement Limitations...................................75
A.2.2 Motherboard Deflection Metric Definition.....................................76
A.2.3 Board Deflection Limits ............................................................77
A.2.4 Board Deflection Metric Implementation Example.........................78
A.2.5 Additional Considerations .........................................................79
A.3 Heatsink Selection Guidelines.................................................................80
Appendix B Heatsink Clip Load Metrology ............................................................................81
B.1 Overview ............................................................................................81
B.2 Test Preparation...................................................................................81
B.2.1 Heatsink Preparation................................................................81
B.2.2 Typical Test Equipment ............................................................84
B.3 Test Procedure Examples.......................................................................84
B.3.1 Time-Zero, Room Temperature Preload Measurement...................85
B.3.2 Preload Degradation under Bake Conditions ................................85
Appendix C Thermal Interface Management.........................................................................87
C.1 Bond Line Management .........................................................................87
C.2 Interface Material Area..........................................................................87
C.3 Interface Material Performance...............................................................87
Appendix D Case Temperature Reference Metrology..............................................................89
D.1 Objective and Scope .............................................................................89
D.2 Supporting Test Equipment....................................................................89
D.3 Thermal Calibration and Controls ............................................................91
D.4 IHS Groove .........................................................................................91
D.5 Thermocouple Attach Procedure .............................................................95
D.5.1 Thermocouple Conditioning and Preparation ................................95
D.5.2 Thermocouple Attachment to the IHS .........................................96
D.5.3 Solder Process ...................................................................... 101
D.5.4 Cleaning and Completion of Thermocouple Installation................ 105
D.6 Thermocouple Wire Management .......................................................... 108
Appendix E Legacy Fan Speed Control .............................................................................. 109
E.1 Thermal Solution Design ..................................................................... 109
E.1.1 Determine Thermistor Set Points ............................................. 109
E.1.2 Minimum Fan Speed Set Point ................................................. 110
E.2 Board and System Implementation ....................................................... 111
E.2.1 Choosing Fan Speed Control Settings ....................................... 111
E.3 Combining Thermistor and On-Die Thermal Sensor Control....................... 115
E.4 Interaction of Thermal Profile and T
CONTROL
............................................. 115
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations.................. 121
Appendix G Fan Performance for Reference Design ............................................................. 125
Appendix H Mechanical Drawings ..................................................................................... 128
Appendix I Intel Enabled Reference Solution Information.................................................... 146