Intel Celeron Dual-Core E1000 Series, Design Manuallines

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4 Thermal and Mechanical Design Guidelines
4.2.10 Digital Thermal Sensor.............................................................38
4.2.11 Platform Environmental Control Interface (PECI)..........................39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ........41
5.1 Overview of the Balanced Technology Extended (BTX) Reference Design ......41
5.1.1 Target Heatsink Performance ....................................................41
5.1.2 Acoustics ...............................................................................42
5.1.3 Effective Fan Curve .................................................................44
5.1.4 Voltage Regulator Thermal Management.....................................45
5.1.5 Altitude..................................................................................46
5.1.6 Reference Heatsink Thermal Validation .......................................46
5.2 Environmental Reliability Testing ............................................................46
5.2.1 Structural Reliability Testing .....................................................46
5.2.2 Power Cycling .........................................................................49
5.2.3 Recommended BIOS/CPU/Memory Test Procedures ......................49
5.3 Material and Recycling Requirements ......................................................49
5.4 Safety Requirements ............................................................................50
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly........50
5.6 Preload and TMA Stiffness .....................................................................51
5.6.1 Structural Design Strategy........................................................51
5.6.2 TMA Preload versus Stiffness ....................................................51
6 ATX Thermal/Mechanical Design Information.......................................................55
6.1 ATX Reference Design Requirements .......................................................55
6.2 Validation Results for Reference Design ...................................................58
6.2.1 Heatsink Performance ..............................................................58
6.2.2 Acoustics ...............................................................................59
6.2.3 Altitude..................................................................................60
6.2.4 Heatsink Thermal Validation .....................................................60
6.3 Environmental Reliability Testing ............................................................61
6.3.1 Structural Reliability Testing .....................................................61
6.3.2 Power Cycling .........................................................................63
6.3.3 Recommended BIOS/CPU/Memory Test Procedures ......................63
6.4 Material and Recycling Requirements ......................................................63
6.5 Safety Requirements ............................................................................64
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......64
6.7 Reference Attach Mechanism..................................................................65
6.7.1 Structural Design Strategy........................................................65
6.7.2 Mechanical Interface to the Reference Attach Mechanism ..............66
7 Intel
®
Quiet System Technology (Intel
®
QST) .....................................................69
7.1 Intel
®
QST Algorithm ............................................................................69
7.1.1 Output Weighting Matrix ..........................................................70
7.1.2 Proportional-Integral-Derivative (PID) ........................................70
7.2 Board and System Implementation of Intel
®
QST......................................72
7.3 Intel
®
QST Configuration and Tuning.......................................................74
7.4 Fan Hub Thermistor and Intel
®
QST ........................................................74
Appendix A LGA775 Socket Heatsink Loading ......................................................................75
A.1 LGA775 Socket Heatsink Considerations ..................................................75
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
with Intel
®
Reference Design .................................................................75