Case Temperature Reference Metrology
108
Thermal and Mechanical Design Guidelines
45.
Place the device in a tray or bag until it is ready to be used for thermal testing
use.
D.6
Thermocouple Wire Management
When installing the processor into the socket, the thermocouple wire should route
under the socket lid, as shown in Figure
7-37. This will keep the wire from getting
damaged or pinched when removing and installing the heatsink.
Note:
When thermocouple wires are damaged, the resulting reading maybe wrong. For
example, if there are any cuts into the wires insulation where the wires are pinched
between the heatsink and the socket lid when installing the heatsink, the
thermocouple wires can get in contact at this location. In that case, the reported
temperature would be the point of the heatsink/socket lid area. This temperature is
usually much lower than the temperature at the center of the IHS.
Prior to installing the heatsink, make sure that the thermocouple wires remain below
the IHS top surface, by running a flat blade on top of the IHS for example.
Figure
7-37. Thermocouple Wire Management
§
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
