Case Temperature Reference Metrology
102
Thermal and Mechanical Design Guidelines
Figure
7-27. Solder Station Setup
27.
Remove the land side protective cover and place the device to be soldered in the
solder station. Make sure the thermocouple wire for the device being soldered is
exiting the heater toward you.
Note:
Do not touch the copper heater block at any time as this is very hot.
28.
Move a magnified lens light close to the device in the solder status to get a better
view when the solder begins to melt.
29.
Lower the Heater block onto the IHS. Monitor the device IHS temperature during
this step to ensure the maximum IHS temperature is not exceeded.
Note:
The target IHS temperature during reflow is 150 °C ±3 °C. At no time should the IHS
temperature exceed 155 °C during the solder process as damage to the device may
occur.
30.
You may need to move the solder back toward the groove as the IHS begins to
heat. Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (Figure
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
