Processor Thermal/Mechanical Information
24
Thermal and Mechanical Design Guidelines
2.4
System Thermal Solution Considerations
2.4.1
Chassis Thermal Design Capabilities
The Intel reference thermal solutions and Intel Boxed Processor thermal solutions
assume that the chassis delivers a maximum T
A
at the inlet of the processor fan
heatsink. The following tables show the T
A
requirements for the reference solutions
and Intel Boxed Processor thermal solutions.
Table
2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
ATX D60188-
001
ATX E18764-001
BTX Type II
Heatsink Inlet
Temperature
40 °C
40 °C
35.5 °C
NOTE:
1.
Intel reference designs (D60188-001 and E18764-001) are assumed be used in the
chassis where expected the temperature rise is 5 °C.
Table
2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
Boxed Processor for Intel
®
Core
™
2 Duo Processor
E6000 and E4000 Series, Intel
®
Pentium
®
Dual Core
Processor E2000 Series, and Intel
®
Celeron
®
Dual-
Core Processor E1000 Series
Heatsink Inlet
Temperature
40 °C
NOTE:
1.
Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged
chassis (refer to Thermally Advantaged Chassis version 1.1 for Thermally Advantaged
Chassis thermal and mechanical requirements).
2.4.2
Improving Chassis Thermal Performance
The heat generated by components within the chassis must be removed to provide an
adequate operating environment for both the processor and other system
components. Moving air through the chassis brings in air from the external ambient
environment and transports the heat generated by the processor and other system
components out of the system. The number, size and relative position of fans and
vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the
thermal solution and the amount of system airflow can be traded off against each
other to meet specific system design constraints. Additional constraints are board
layout, spacing, component placement, acoustic requirements and structural
considerations that limit the thermal solution size. For more information, refer to the
Performance ATX Desktop System Thermal Design Suggestions or Performance
microATX Desktop System Thermal Design Suggestions or Balanced Technology
Extended (BTX) System Design Guide documents available on the
http://www.formfactors.org/
web site.
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
