Case Temperature Reference Metrology
106
Thermal and Mechanical Design Guidelines
36.
Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
37.
Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (see Figure
Figure
7-33. Filling Groove with Adhesive
38.
To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (see Figure
Figure
7-34. Application of Accelerant
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
