Introduction
14
Thermal and Mechanical Design Guidelines
Term Description
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as
(T
C
– T
S
) / Total Package Power.
Note: Heat source must be specified for
Ψ
measurements.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as
(T
S
– T
A
) / Total Package Power.
Note: Heat source must be specified for
Ψ
measurements.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
P
MAX
The maximum power dissipated by a semiconductor component.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
IHS
Integrated Heat Spreader: a thermally conductive lid integrated into a processor
package to improve heat transfer to a thermal solution through heat spreading.
LGA775
Socket
The surface mount socket designed to accept the processors in the 775–Land LGA
package.
ACPI
Advanced Configuration and Power Interface.
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Thermal
Monitor
A feature on the processor that attempts to keep the processor die temperature within
factory specifications.
TCC
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
T
DIODE
Temperature reported from the on-die thermal diode.
FSC
Fan Speed Control: Thermal solution that includes a variable fan speed which is driven
by a PWM signal and uses the on-die thermal diode as a reference to change the duty
cycle of the PWM signal.
T
CONTROL
T
CONTROL
is the specification limit for use with the on-die thermal diode.
PWM
Pulse width modulation is a method of controlling a variable speed fan. The enabled 4
wire fans use the PWM duty cycle % from the fan speed controller to modulate the fan
speed.
Health
Monitor
Component
Any standalone or integrated component that is capable of reading the processor
temperature and providing the PWM signal to the 4 pin fan header.
BTX
Balanced Technology Extended.
TMA
Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
solution
§
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
