Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
97
Figure
7-19. Thermocouple Bead Placement
(A)
(B)
16.
Place the package under the microscope to continue with process. It is also
recommended to use a fixture (like processor tray or a plate) to help holding the
unit in place for the rest of the attach process.
17.
While still at the microscope, press the wire down about 6mm [0.125”] from the
thermocouple bead using the tweezers or your finger. Place a piece of Kapton*
tape to hold the wire inside the groove (Figure
detailed bead placement.
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
