Case Temperature Reference Metrology
94
Thermal and Mechanical Design Guidelines
The orientation of the groove at 6 o’clock exit relative to the package pin 1 indicator
(gold triangle in one corner of the package) is shown in Figure
LGA package IHS.
Figure
7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package
When the processor is installed in the LGA775 socket, the groove is parallel to the
socket load lever, and is toward the IHS notch as shown Figure
Figure
7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the LGA775 Socket
Select a machine shop that is capable of holding drawing specified tolerances. IHS
groove geometry is critical for repeatable placement of the thermocouple bead,
ensuring precise thermal measurements. The specified dimensions minimize the
impact of the groove on the IHS under the socket load. A larger groove may cause the
IHS to warp under the socket load such that it does not represent the performance of
an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Pin1 indicator
IHS Groove
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
