Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
105
D.5.4
Cleaning and Completion of Thermocouple
Installation
33.
Remove the device from the solder station and continue to monitor IHS
Temperature with a handheld meter. Place the device under the microscope and
remove the three pieces of Kapton* tape with Tweezers, keeping the longest for
re-use.
34.
Straighten the wire and work the wire in to the groove. Bend the thermocouple
over the IHS. Replace the long piece of Kapton* tape at the edge of the IHS.
Note:
The wire needs to be straight so it doesn’t sit above the IHS surface at anytime (see
Figure
Figure
7-31. Thermocouple placed into groove
35.
Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (see Figure
Figure
7-32. Removing Excess Solder
Note:
Take usual precautions when using open blades
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
