Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
95
D.5
Thermocouple Attach Procedure
The procedure to attach a thermocouple with solder takes about 15 minutes to
complete. Before proceeding turn on the solder block heater, as it can take up to
30 minutes to reach the target temperature of 153 – 155 °C.
Note:
To avoid damage to the processor ensure the IHS temperature does not exceed
155 °C.
As a complement to the written procedure a video Thermocouple Attach Using Solder
– Video CD-ROM is available.
D.5.1
Thermocouple Conditioning and Preparation
7.
Use a calibrated thermocouple as specified in Sections
D.3.
8.
Under a microscope verify the thermocouple insulation meets the quality
requirements. The insulation should be about 1/16 inch (0.062 ± 0.030) from the
end of the bead (Figure
Figure
7-16. Inspection of Insulation on Thermocouple
9.
Measure the thermocouple resistance by holding both contacts on the connector
on one probe and the tip of thermocouple to the other probe of the DMM
(measurement should be about~3.0 ohms for 36-gauge type T thermocouple).
10.
Straighten the wire for about 38 mm [1 ½ inch] from the bead.
11.
Using the microscope and tweezers, bend the tip of the thermocouple at
approximately 10 degree angle by about 0.8 mm [.030 inch] from the tip
(Figure
Summary of Contents for Celeron Dual-Core E1000 Series
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Page 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Page 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Page 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Page 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Page 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...