
APPENDIX E: GUIDELINES FOR REFLOW SOLDERING
UNIFLOW
®
4 PULSED HEAT CONTROL
E-6
990-908
PAD SIZE AND
PITCH
Mm/ inches
TARGET SOLDER
VOLUME
mm³ / inches
SCREEN THICKNESS
Microns / inches
OPENING CHEM.NI/AU
HOT AIR LEVEL
mm / inches
Cu PASSIVE / PALLADIUM
mm / inches
200 micron / 0.008”
0.4 x 1.4 / 0.016 x 0.055
0.4 x 2.0 / 0.016 x 0.055
Pad size
1 x 4.5mm
0.039 x 0.177”
Pitch – 2.0 mm
0.079”
0.07 – 0.1 mm
0.0028 – 0.0039”
100 micron / 0.004”
0.74 x 1.9 / 0.029 x 0.075
0.74 x 2.7 / 0.029 x 0.106
150 micron / 0.006”
0.6 x 1.5 / 0.024 x 0.059
0.6 x 2.2 / 0.024 x 0.086
175 micron / 0.007”
0.5 x 1.6 / 0.020 x 0.063
0.5 x 2.3 / 0.020 x 0.091
200 micron / 0.008”
0.4 x 1.7 / 0.016 x 0.067
0.4 x 2.5 / 0.016 x 0.098
Pad size
1.5 x 5.5 mm
0.059” x 0.216”
Pitch – 3.0
0.118”
0.13 – 0.19 mm
0.0051 – 0.0075”
100 micron / 0.004”
1.2 x 2.2 / 0.047 x 0.087
1.2 x 3.1 / 0.047 x 0.122
150 micron / 0.006”
1.1 x 1.6 / 0.043 x 0.063
1.1 x 2.3 / 0.043 x 0.091
175 micron / 0.007”
1.0 x 1.5 / 0.039 x 0.059
1.0 x 2.1 / 0.039 x 0.083
200 micron / 0.008”
0.9 x 1.4 / 0.035 x 0.055
0.9 x 2.0 / 0.035 x 0.055
Thermode Sizing And Positioning To Parts
Thermodes should be sized according to the pad and flex sizes as shown in the figure below. The
thermode length must completely cover the traces and overlap by a minimum of one pad pitch on each
side. The thermode width should provide enough thermal transfer of heat to achieve the solder joint in
the minimum time thereby eliminating the chance of thermal damage to the parts. The width of the
thermode should also accommodate enough room for the molten solder to be displaced, eliminating any
chance of solder bridging.
Thermode Width
For the best thermal performance and lifetime of the thermode, the minimum size should be 0.059”. The
standard size is 0.079”, due to better performance and longevity. Where solder amounts are not well
controlled or room is limited, it is possible to use a 0.047” wide thermode however thermode life and
performance will be reduced.
Summary of Contents for UNIFLOW 4 REMOTE
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