ZEISS
3 Product and Functional Description | 3.1 System Overview
Optional
Components and
Accessories
1
2
4
3
6
7
8
9
10
11
5
Fig. 9: Optional components and accessories
1
WDS for highest sensitivity chemical
analysis
2
Local charge compensator for SEM
imaging and analysis of non-conductive
specimens
Refer to the instruction manual Charge
Compensator
3
4
Annular STEM detector (aSTEM) for
transmission imaging and quality con-
trol
Refer to
5
C2D Detector
Refer to
6
Single needle GIS for high angle speci-
men access
Refer to the instruction manual Single
GIS
7
Manipulators for specimen modification
and probing
8
BSD detector for high efficiency and an-
gle selective material characterization.
Detection of up to 4 channels in parallel
possible
Refer to
and
9
Airlock solution (80 mm or 200 mm
wide) for fast and efficient specimen
transfer and fast pumping times
Refer to the respective instruction man-
ual 80-mm Airlock or 200-mm Airlock
10
EBSD for crystallographic mapping
11
Control panel
Refer to
Further options:
§
Nanopatterning and Visualization Engine (ATLAS) for advanced patterning and lithography
tasks
Information will be provided by the manufacturer
§
Plasma Cleaner
Refer to the instruction manual Plasma Cleaner
§
Electrostatic Beam Blanker for SEM
Refer to the instruction manual Beam Blanker
§
Further options on request
Instruction Manual ZEISS GeminiSEM series | en-US | Rev. 2 | 349500-8138-000
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