Technical Data
135/223
PC Cards cifX PCI, PCIe, Low Profile PCIe | Installation, Operation and Hardware Description
DOC120204UM46EN | Revision 46 | English | 2015-12 | Relelased | Public
© Hilscher, 2008-2015
CIFX 50-2DP\DN
Parameter
Value
6 MBit/s, 12 MBit/s
Interface Type
2 * RS 485, refer to section
PROFIBUS Interface
p. 107.
Galvanic Isolation
isolated
Isolation Voltage
1000 VDC (tested for 1 minute)
Connector
DSub female Connector, 9 pin
DeviceNet
Communication
Supported communication
standard/ protocol (determined by
the loaded firmware)
DeviceNet Master,
DeviceNet Slave
Transmission rate
125 kBit/s, 250 kBit/s, 500 kBit/s
Interface Type
ISO-11898 according to DeviceNet specification,
refer to section
DeviceNet Interface
, page 108.
Galvanic Isolation
optically isolated
Isolation Voltage
1000 VDC (tested for 1 minute)
DeviceNet Interface
Connector
CombiCon male Connector, 5 pin
SYS
System Status LED
COM 0
LED Communication Status 0 (duo LED) for
channel X1
MNS 1
DeviceNet-Status 1 (duo LED) for channel X2
Display LED
Display
The meaning of the LEDs COM0 and MNS1 depends on
the loaded firmware. Refer to chapter
LED Descriptions
,
page 80.
Supply Voltage
+3.3 V dc ±5 %, refer to section
Power Supply and Host
Interface
, page 34.
Maximum Current at 3.3 V
(typically)
700 mA
Power supply
Connector
Via PCI Bus
Operation
Rotary Switch Slot Number
(Card ID)
To set the Slot Number (Card ID)
Operating temperature range*
-20 °C ... +70 °C
*Air flow during measurment
0,5m/s
Storage temperature range
-10 °C ... +70 °C
Environmental
Conditions
Humidity
10 … 95% relative humidity, no condensation permitted
Dimensions (L x W x H)
120 x 94,5 x 18,5 mm
Mounting/Installation
PCI slot (3.3 V), refer to section
Slot for the PC Cards cifX
PCI, PCIe and Low Profile PCIe
, page 33.
Device
RoHS Yes
CE Sign
Yes
Emission
EN 55011:2009 + A1:2010, CISPR 11:2009, Class A
(Radio disturbance characteristics - Limits and methods of
measurement)
CE Sign
Immunity
EN 61000-4-2:2009 (Electrostatic discharge test)
EN 61000-4-3:2006 + A1:2008 + A2:2010 (Radiated,
radio-frequency, electromagnetic field test)
EN 61000-4-4:2004 + A1:2010 (Burst Electrical fast
transients/burst test)
EN 61000-4-5:2006 (Surge test)
EN 61000-4-6:2009 (to conducted disturbances, induced
by radio- frequency fields)
EN 61000-4-8:2010 (power frequency magnetic field test)
EN 61000-6-2:2005 + B1:2011 (for industrial
environments)