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MPC5553/MPC5554 Microcontroller Reference Manual, Rev. 5
2-68
Freescale Semiconductor
Many changes were made to the footnotes of
(MPC5554). The number of footnotes to
increased to 50 from 30. The number of footnotes to
increased to 36 from the 28 that was the total in the
MPC5553/MPC5554 version 3.1 reference manual. Among the more notable footnote changes are the following:
• Reconciled all footnotes with those in the MPC556X devices.
• Footnote 6 of the previous manual became Footnote 10 of MPC5553, and it was changed to read: “BOOTCFG[0] is not
available and will always be read as 0 in the 208 package of the MPC5553”
•
Added footnote 12. The EBI is 32 bits and can be configured as: a 32-bit external I/O data bus EBI; the lower
16-bits for the EBI and the upper 16-bits Fast Ethernet (FE); the calibration bus (CBI) uses 21 address pins [10:30] and 16
data pins [0:15].
•
Added footnote 16 because the calibration bus interface (CBI) and the external bus interface (EBI) share the same
bus, the CBI uses EBI signals ADDR[12:26] in addition to the CAL_ADDR[10:11, 27:30] signals for calibration addressing.
Set the PA field in the SUI_PCR register to 0b1 to use the CBI or EBI.
• Footnotes 25/15 (in both devices): changed “The function of the MDO[11:4]_GPIO[82:75] pins is selected during a debug
port reset by the EVTI pin.” to read “The function of the MDO[11:4]_GPIO[82:75] pins is selected during a debug port reset
by the EVTI pin or by selecting FPM in the NPC_PCR.”
• Changed footnote 33 in
from: 0b000 to 0b00 for analog serial data strobe functions. These registers have a 2-bit
PA value. Changed footnote 20 in
from: 0b000 to 0b00. Changed in the detailed signal description as well.
• Removed CAL_OE, CAL_RD_WR and CAL_TS from
. Added footnotes 18, 20, and 21 that the calibration bus uses
the OE, RD_WR, and TS external bus functions:
• Because the calibration bus interface (CBI) and the external bus interface (EBI) share the same external bus, RD_WR is
used for both the CBI and the EBI.
• Because the calibration bus interface (CBI) and the external bus interface (EBI) share the same external bus, OE is used
for both the CBI and the EBI.
• Because the calibration bus interface (CBI) and the external bus interface (EBI) share the same external bus, TS is used
for both the CBI and the EBI.
• Footnotes 23/25 in the previous version of the manual became Footnote 41 which changed from: “The V
DDAn
and V
SSAn
supply inputs are separate traces in the package substrate. Each trace is bonded to a separate pad location, which provides
isolation between the analog and digital sections within each ADC.
” to “
Each VDDAn and VSSAn connects to one ADC
engine to provide isolation.
”
• Changed Footnote 1 of the Power/Ground segmentation tables of both devices to read: “
These are nominal voltages. V
DDE
is
1.62–3.6 V; V
DDEH
is 3.0–5.5 V. All V
DDE
voltages are
10%; V
DDEH
voltages are +5%/–10%.V
RC33
is
10%; V
DDSYN
is
10%; V
DDA1
is
+ 5%, –10%.
”
Table 2-10.
Changes Added to MPC5553/5554 RM for Rev. 5.0 Release
In
and
, corrected the ball numbers in the Power / Ground Signals section, Pin Labels / Package Type
column.
Table 2-9.
Changes Added to MPC5553/5554RM for Rev. 4.0 Release (Continued)
Содержание MPC5553
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