phyCORE-i.MX35
50
PHYTEC Messtechnik GmbH 2010 L-734e_1
14
Hints for Handling the phyCORE-i.MX35
Removal of various components, such as the microcontroller and the standard quartz, is not
advisable given the compact nature of the module. Should this nonetheless be necessary, please
ensure that the board as well as surrounding components and sockets remain undamaged while de-
soldering. Overheating the board can cause the solder pads to loosen, rendering the module
inoperable. Carefully heat neighboring connections in pairs. After a few alternations, components can
be removed with the solder-iron tip. Alternatively, a hot air gun can be used to heat and loosen the
bonds.
Summary of Contents for phyCORE-i.MX35
Page 51: ...CAN PHYTEC Messtechnik GmbH 2010 L 734e_1 43...
Page 55: ...JTAG Interface X2 PHYTEC Messtechnik GmbH 2010 L 734e_1 47...
Page 59: ...Hints for Handling PHYTEC Messtechnik GmbH 2010 L 734e_1 51...
Page 109: ...Revision History PHYTEC Messtechnik GmbH 2010 L 734e_1 101...
Page 115: ...Published by PHYTEC Messtechnik GmbH 2010 Ordering No L 734_1 Printed in Germany...