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Service Guide OF1000
Chapter 4 Failure & Repair Analysis
4.1.01 Introduction
This section is used to isolate problems to the assembly level. Application problems and detection of faulty
components on the printed circuit boards are not addressed.
When troubleshooting a defective unit,
refer first to Section 4.4
of this Service Handbook.
This
section contains tips on preventing problems as well as a list of common problems.
Next, refer to Section 4.5
. Repair Analysis Procedures (RAPs)
will ask you questions or require you
to make observations. The answers to these questions and the results of your observations determine
your next course of action. Use the RAP Index to identify which RAP should be used to resolve the
problem with the machine.
If you encounter a situation that is not addressed by the documentation in this kit, please report the
problem to Okidata. Send your report to the Okidata Technical Training Group. Refer to the Service
Center Reference Guide for information on contacting Okidata.
The following information is provided to detect and analyze failures.
1. Okilink II, Faxable Facts, Technical Service Bulletins
2. Troubleshooting Tips / Common Problems
3. Repair Analysis Procedures
4. Tests
5. Reports
6. Resets
7. Technical Functions
Copyright 1997, Okidata, Division of OKI America, Inc. All rights reserved. See the OKIDATA Business
Partner Exchange (BPX) for any updates to this material. (http://bpx.okidata.com)
Summary of Contents for OF1000
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