MAX-M10M - Integration manual
Figure 33: Tape dimensions (mm)
5.2.3 Moisture sensitivity level
The moisture sensitivity level (MSL) for MAX-M10M modules is specified in the table below.
Package
MSL level
LCC (professional grade)
4
Table 32: MSL level
For MSL standard see IPC/JEDEC J-STD-020, and J-STD-033 that can be downloaded from
. For more information regarding moisture sensitivity levels, labeling, storage and
drying, see the u-blox packaging information reference [
].
5.3 Soldering
Reflow soldering procedures are described in the IPC/JEDEC J-STD-020 standard.
When populating the modules, make sure that the pick and place machine is aligned to the
copper pins of the module and not to the module edge.
Soldering paste
Use of “no clean” soldering paste is highly recommended, as it does not require cleaning after the
soldering process. The paste in the example below meets these criteria.
• Soldering paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
• Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% tin/ 4% silver/ 0.5% copper)
• Melting temperature: 217 °C
UBX-22038241 - R02
5 Product handling
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