5-64
PMW-EX3
(MA-164 BOARD)
Ref. No.
or Q’ty Part No. SP Description
R32 1-208-895-81 s RES, CHIP 2.2K (1005)
R33 1-208-895-81 s RES, CHIP 2.2K (1005)
R34 1-208-927-81 s RES, CHIP 47K (1005)
R35 1-208-879-81 s RES, CHIP 470 (1005)
R36 1-208-879-81 s RES, CHIP 470 (1005)
R37 1-208-879-81 s RES, CHIP 470 (1005)
R38 1-208-879-81 s RES, CHIP 470 (1005)
R39 1-208-935-81 s RES, CHIP 100K (1005)
R40 1-208-935-81 s RES, CHIP 100K (1005)
R41 1-208-935-81 s RES, CHIP 100K (1005)
R42 1-208-935-81 s RES, CHIP 100K (1005)
------------
PS-747 BOARD
------------
Ref. No.
or Q’ty Part No. SP Description
1pc A-1545-798-A s MOUNTED CIRCUIT BOARD, PS-747
C1 1-107-891-51 s CAP, ELECT 3300MF
CN1 1-770-160-21 s PIN, CONNECTOR (PC BOARD) 2P
------------
RE-260 BOARD
------------
Ref. No.
or Q’ty Part No. SP Description
1pc A-1550-168-A s MOUNTED CIRCUIT BOARD, RE-260
C14 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C15 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608)
C17 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C18 1-137-980-91 s CAP,CHIP CERAMIC 0.47MF B 3216
C19 1-112-863-91 s CAP, CERAMIC 0.22MF B (1005)
C21 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C22 1-112-727-21 s CAP, ELECT 47MF (8.0X6.9)
C23 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C24 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C25 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C26 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608
C27 1-162-923-91 s CAP, CERAMIC 47PF CH 1608
C28 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C29 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C30 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608
C31 1-164-227-91 s CAP,CERAMIC 22000PF B 1608
C32 1-164-227-91 s CAP,CERAMIC 22000PF B 1608
C33 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C34 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608)
C35 1-112-863-91 s CAP, CERAMIC 0.22MF B (1005)
C36 1-162-969-91 s CAP, CERAMIC 6800PF B 1608
C37 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C38 1-162-969-91 s CAP, CERAMIC 6800PF B 1608
C39 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C40 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C41 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C42 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C43 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C44 1-135-349-21 s CAP, ELECT 22MF (6.3X6)
C46 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C47 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C48 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C49 1-112-180-21 s CAP, ALUMINIUM ELECT 150MF
C50 1-112-180-21 s CAP, ALUMINIUM ELECT 150MF
C51 1-112-784-11 s CAP, ELECT(SOLID)
C57 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C58 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C59 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C60 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C61 1-112-785-11 s CAP, ELECT(SOLID)
C62 1-112-785-11 s CAP, ELECT(SOLID)
C63 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608)
C64 1-112-863-91 s CAP, CERAMIC 0.22MF B (1005)
C65 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608)
C66 1-112-863-91 s CAP, CERAMIC 0.22MF B (1005)
C67 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C68 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C200 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C201 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C202 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C203 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C204 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C205 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C206 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C207 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C208 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C209 1-165-989-91 s CAP, CERAMIC 10MF (2012)
Содержание XDCAM EX PMW-EX3
Страница 1: ...SOLID STATE MEMORY CAMCORDER PMW EX3 SERVICE MANUAL 1st Edition Revised 1 ...
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Страница 224: ...8 36 PMW EX3 8 36 2 3 4 5 A B C D E F G H 1 ...
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Страница 254: ...8 36 PMW EX3 8 36 2 3 4 5 A B C D E F G H 1 ...
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Страница 314: ...Printed in Japan Sony Corporation 2009 2 16 2008 PMW EX3 UC E CE CN E 9 968 446 02 ...