5-25
PMW-EX3
(ASW-66 BOARD)
Ref. No.
or Q’ty Part No. SP Description
R158 1-208-927-81 s RES, CHIP 47K (1005)
R159 1-208-911-81 s RES, CHIP 10K (1005)
R160 1-208-911-81 s RES, CHIP 10K (1005)
R161 1-208-927-81 s RES, CHIP 47K (1005)
R162 1-208-887-81 s RES, CHIP 1.0K (1005)
R163 1-208-911-81 s RES, CHIP 10K (1005)
R164 1-208-911-81 s RES, CHIP 10K (1005)
R165 1-208-911-81 s RES, CHIP 10K (1005)
R166 1-208-887-81 s RES, CHIP 1.0K (1005)
R167 1-208-911-81 s RES, CHIP 10K (1005)
R168 1-208-927-81 s RES, CHIP 47K (1005)
R600 1-208-895-81 s RES, CHIP 2.2K (1005)
RB101 1-234-380-21 o RES, NETWORK 47K (1005X4)
RB102 1-234-380-21 o RES, NETWORK 47K (1005X4)
S100 1-572-922-31 s SWITCH, SLIDE
S101 1-572-922-31 s SWITCH, SLIDE
S102 1-572-922-31 s SWITCH, SLIDE
S103 1-572-922-31 s SWITCH, SLIDE
------------
AU-318 BOARD
------------
Ref. No.
or Q’ty Part No. SP Description
1pc A-1545-724-A s MOUNTED CIRCUIT BOARD, AU-318
C1 1-131-661-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C2 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C3 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C4 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C5 1-162-966-91 s CAP, CERAMIC 2200PF B 1608
C6 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C8 1-165-467-21 s CAP, ELECT 47MF 8X10
C9 1-137-980-91 s CAP,CHIP CERAMIC 0.47MF B 3216
C10 1-165-467-21 s CAP, ELECT 47MF 8X10
C11 1-137-980-91 s CAP,CHIP CERAMIC 0.47MF B 3216
C17 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C18 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C19 1-165-176-91 s CAP,CERAMIC 47000PF B 1608
C20 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608
C21 1-162-915-91 s CAP, CERAMIC 10PF CH 1608
C22 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C23 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C50 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C51 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C52 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C53 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C103 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C104 1-126-401-21 s CAP, CHIP ELECT 1MF (4X5.7)
C105 1-126-401-21 s CAP, CHIP ELECT 1MF (4X5.7)
C106 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C107 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C108 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C109 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C110 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C111 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C112 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C113 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C114 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C115 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C116 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C117 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C118 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C119 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C120 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C121 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C122 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C123 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C124 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C125 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C126 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C127 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C128 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C129 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C130 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C131 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C134 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C135 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C136 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C137 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C138 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C203 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C204 1-126-401-21 s CAP, CHIP ELECT 1MF (4X5.7)
Содержание XDCAM EX PMW-EX3
Страница 1: ...SOLID STATE MEMORY CAMCORDER PMW EX3 SERVICE MANUAL 1st Edition Revised 1 ...
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Страница 224: ...8 36 PMW EX3 8 36 2 3 4 5 A B C D E F G H 1 ...
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Страница 254: ...8 36 PMW EX3 8 36 2 3 4 5 A B C D E F G H 1 ...
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Страница 314: ...Printed in Japan Sony Corporation 2009 2 16 2008 PMW EX3 UC E CE CN E 9 968 446 02 ...