CHAPTER 31 ELECTRICAL SPECIFICATIONS
Page 868 of 920
Note 1.
Total current flowing into V
DD
, including the input leakage current flowing when the level of the input pin is fixed to V
DD
or
V
SS
. The values below the MAX. column include the peripheral operation current. However, not including the current
flowing into the RF transceiver, A/D converter, LVD circuit, I/O port, and on-chip pull-up/pull-down resistors and the
current flowing during data flash rewrite.
Note 2.
During HALT instruction execution by flash memory.
Note 3.
When high-speed on-chip oscillator and subsystem clock are stopped.
Note 4.
When high-speed system clock and subsystem clock are stopped.
Note 5.
When high-speed on-chip oscillator and high-speed system clock are stopped. When RTCLPC = 1 and setting ultra-low
current consumption (AMPHS1 = 1). The current flowing into the RTC is included. However, not including the current
flowing into the 12-bit interval timer and watchdog timer.
Note 6.
Not including the current flowing into the RTC, 12-bit interval timer, and watchdog timer.
Note 7.
Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.
HS (high-speed main) mode:
2.7 V
≤
V
DD
≤
3.6 V@1 MHz to 32 MHz
2.4 V
≤
V
DD
≤
3.6 V@1 MHz to 16 MHz
LS (low-speed main) mode:
1.8 V
≤
V
DD
≤
3.6 V@1 MHz to 8 MHz
Note 8.
Regarding the value for current to operate the subsystem clock in STOP mode, refer to that in HALT mode.
Remark 1.
f
MX
:
High-speed system clock frequency (X1 clock oscillation frequency or external main system clock frequency)
Remark 2.
f
IH
:
High-speed on-chip oscillator clock frequency (32 MHz max.)
Remark 3.
f
SUB
:
Subsystem clock frequency (XT1 clock oscillation frequency)
Remark 4.
Except subsystem clock operation and STOP mode, temperature condition of the TYP. value is T
A
= 25 °C
Содержание RL78/G1H
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