OM-SC7610
Operation
Issue 1
25
SC7610 Sputter Coater
6.4 Sputtering
Rates
The following sputtering rates have been measured using the FT7690 Film Thickness monitor with a
45mm gap between the targets and the stage crystal holder. The plasma was established using "zero"
grade argon gas at the vacuum level required to achieve plasma current. Evacuation of the work
chamber was achieved with a 90 l/min two stage rotary pump. Each target was cleaned by sputtering at
25mA for three minutes prior to coating for the measurements.
The graphs show typical sputter rates achieved on a standard instrument under the conditions as
specified and are intended only as a guide to coating thickness.
Figure 6.1 – SC7610 Sputtering Rates
0
5
10
15
20
25
0
1
2
3
4
5
6
7
8
9
10
Plasma Current (mA)
R
a
te
(
n
m/
mi
n
)
Gold Au/Pd
Platinum
Nickel
Silver
Palladium
Copper
Sputtering rate SC7610